【MWC 2026】Rohde & Schwarz and Realtek Jointly Demonstrate the Industrys First Bluetooth® Low Energy High-Data-Throughput Test Solution

【MWC 2026】Rohde & Schwarz and Realtek Jointly Demonstrate the Industry''s First Bluetooth® Low Energy High-Data-Throughput Test Solution

Date:2026-03-09 09:18:07

The advanced capabilities of the R&S CMP180 make it an ideal Bluetooth® test solution spanning R&D, pre-certification, and mass production phases. The CMP180 is now ready for future enhancements to Bluetooth® Low Energy in higher frequency bands and is also well-suited for multi-technology and multi-device testing.

The Bluetooth® Low Energy HDT (High Data Throughput) feature serves as the cornerstone of next-generation Bluetooth® Low Energy. By increasing the maximum data rate from 2 Mbps to 7.5 Mbps, HDT significantly enhances traditional use cases and gives rise to new applications, including low-latency audio streaming, rapid media sharing, and accelerated wireless software updates. Technically, the new HDT feature offers up to a 4x capacity increase, higher energy efficiency, improved spectral efficiency, and greater reliability. The new Bluetooth® Low Energy physical layer will support five different data rates ranging from 2 Mbps to 7.5 Mbps by combining three new modulation schemes and different levels of forward error correction.

Realtek’s next-generation Wi-Fi/Bluetooth combo chip RTL8922D and Bluetooth audio chip RTL8773J together provide a comprehensive platform for high-performance wireless and audio platforms. RTL8922D is a multi-functional Wi-Fi and Bluetooth combo chip that integrates HDT, channel sounding, and IEEE 802.15.4, enabling simultaneous connectivity of Wi-Fi, dual Bluetooth, and Zigbee/Thread for PCs, TVs, gaming consoles, automotive, and smart home devices. RTL8773J is a dedicated Bluetooth audio SoC that integrates classic Bluetooth, Bluetooth Low Energy, LE Audio, and HDT, providing energy-efficient, low-latency audio processing for smart audio products while enhancing robustness for continuous transmission with HDT support.

The CMP180 supports numerous cellular and non-cellular technologies, including Wi-Fi 6 and 5G NR FR1, up to a frequency of 8 GHz and a bandwidth of up to 500 MHz. It supports Bluetooth® Low Energy testing via Bluetooth® Low Energy direct test mode as well as chipset-specific test control methods, and is already prepared for the new universal test protocol. The CMP180 is equipped with two analyzers, two signal generators, and two groups of eight RF ports each within a single chassis. Overall, the CMP180 is a cost-effective test solution for advanced wireless technologies, capable of meeting current and future testing requirements.

Goce Talaganov (Vice President, Mobile Wireless Test Business, Rohde & Schwarz):
"We are collaborating closely with Realtek Semiconductor on the upcoming Bluetooth® Low Energy features to showcase the unique capabilities of the CMP180 throughout the entire product lifecycle. Our experience in wireless device testing and our early collaboration with Realtek enable us to deliver first-class testing solutions to our customers."

Yee-Wei Huang (Vice President and Spokesperson, Realtek Semiconductor):
"Bluetooth Low Energy HDT is a key technology driving the next generation of immersive audio and seamless connectivity experiences. By combining the RTL8922D Wi-Fi/Bluetooth combo chip and the RTL8773J Bluetooth audio SoC with the R&S CMP180 test platform, we can help our customers bring HDT-supported products to market faster, providing proven performance from R&D to mass production."

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